Laptop BGA Stencils Reballing Stencils/Template for BGA Chipsets
No Pb/Lead Free
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES.
Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours
Pay attention to the difference between leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips: 245℃-260℃(Maximun)
Leaded/Pb BGA chips:180℃-205℃(Maximun)
TV160 TV LCD Tester
Xeltek Superpro 610P Programmer
DHL/FedEx - 3~7 days
EMS - 12~33 days
China Post/SG Post/HK Post - 15~60 days
*Shipping cost & Shipping time is different for each Courier company